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Spring 2003

Industry-university funding program open
Washington's technology scorecard released
Financing tool for rural technology companies
SBIR series continues
Companies meet state legislators
WTC funds more projects
• Microfab Lab news
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Microfab Lab news

New Microfab Lab web site launched!
The Lab recently unveiled its updated and improved web site: http://microfab.watechcenter.org/. New features include direct links to process and equipment capabilities, plenty of illustrations, and a descriptive format that addresses questions from the beginning MEMS researcher to the seasoned MEMS professional.

Currently under development is an enhanced password-protected lab user section, which will enable users to:

 
  • make, change or cancel equipment reservations
  • enroll in or cancel training
  • read and print all lab documentation
  • list all equipment the user is authorized to operate
  • order lab supplies
The Lab is expanding its business to a national audience. The web site is the most effective tool for providing information to a broad technical audience. Check it out!

Latest equipment arrivals
The capabilities of the Microfabrication Lab were strengthened as the result of two equipment donations from industrial sources:

Intel SEM
Intel has provided the Microfab Lab with an AMRAY 3800 scanning electron microscope (SEM) from their R&D facility in Hillsboro, OR. The SEM can accommodate wafers up to 8" in diameter, and the stage tilts 45º to allow full scanning of processed wafers without repositioning. In addition, the SEM has an EDAX (energy-dispersive x-ray analysis) system that permits chemical identification of materials being imaged. The AMRAY SEM represents a valuable addition to the suite of inspection and characterization tools available in the Lab.

Trion RIE
Trion Technology has donated a Mini-Lock II reactive ion etching (RIE) system to the Lab. This plasma etching tool is a state-of-the-art version of the Lab's current Trion Phantom RIE system, and includes an inductively-coupled plasma (ICP) source to increase etching performance, a load lock to minimize the etch chamber's exposure to atmosphere, and an electrostatic chuck for secure wafer hold-down during processing. The new RIE will allow a new range of materials to be plasma-etched, at enhanced rates, and with improved precision. The system is expected to be on line in April.

Marketing intern joins staff
Rachel Kuller joined the Lab's staff in March as a student intern. A master's candidate in sociology, Rachel has a B.S. in mechanical engineering from Harvard and several years' R&D experience at Hewlett-Packard. Rachel's work will include market research for current and new process capabilities to better serve the Lab's client base.

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